- AI infrastructure, engineering software and specialized AI models attracted fresh capital across China’s deep-tech sector
- New funding is accelerating advances in chip interconnects, AI-driven engineering, dermatology and aerospace thermal management
Gention closes pre-Series A round for AI server interconnect chips
Shanghai-based AI server high-speed interconnect chipmaker Gention (格通智联) has completed a Pre-A round worth several hundred million yuan.
The round was led by ZJ High-Tech, with participation from Biren Technology, CDB Capital, Xin Ding Capital, Lenovo Capital and Shanghai Finance.
Gention will use the proceeds to develop and manufacture its GT-Link southbound interconnect chip and GT-Fabric southbound switch chip, while promoting the G-Link open interconnect standard.
Based in the Zhangjiang Integrated Circuit Design Industrial Park, Gention develops open, decoupled high-speed interconnect solutions for AI server clusters.
The company is targeting the growing demand for high-speed chip-to-chip connectivity as domestic AI computing clusters scale up.
Uniforce AI nets nearly $7.44 million in angel+ round
Shanghai-based AI-for-engineering company Uniforce AI (原力引擎) has raised nearly 50 million yuan ($7.44 million) in an angel+ financing round.
The round was jointly led by Shanghai Engine Fund and Shanghai STVC Group, with Fudan Innovation & Entrepreneurship joining as a co-lead investor. Loongson Venture Capital and Chengwei Capital also participated.
Founded by Westlake University engineering professor Wu Tailin (吴泰霖), Uniforce AI develops AI-native infrastructure for simulation, control, diagnostics and design of complex engineering systems.
The company is using controlled nuclear fusion as its initial validation scenario, with its generative AI control algorithms already validated in experiments on operating equipment.
It plans to expand into oil and gas, nuclear power, aerospace and other energy and advanced manufacturing sectors.
Tidu Yueqian secures tens of millions of yuan in strategic round
Suzhou-based skin AI model developer Tidu Yueqian (梯度跃迁), formerly known as Gimay Technology (智美科技), has completed a strategic round worth tens of millions of yuan from Sunz Fund.
Founded in 2024, the company develops AI models for skin detection, diagnosis and analysis, covering dermatological conditions and skin-aging assessment.
Its proprietary VidSkin foundation model is designed to integrate 2D and 3D skin imaging with pathological knowledge, with the long-term goal of developing a skin-focused world model with expert-level diagnostic capabilities.
The company’s products and services are already used by more than 10,000 skin-care and dermatology institutions across China, including public hospitals, private medical providers, skin-care facilities and cosmetics retailers.
Real Thermal Management bags $7.44 million in Series A+ round
Nantong-based aerospace thermal-management company Real Thermal Management (锐莱新能源) has raised 50 million yuan ($7.44 million) in a Series A+ funding round from Innoangel Fund, FG Venture, Jicui Huacai and Xiangjiang Xincheng, with existing investor Jolmo continuing to invest.
The company will use the proceeds to develop active thermal-management systems for spacecraft and expand production of passive thermal-management products.
Its core team comes from the China Academy of Space Technology and has participated in major national programs including crewed spaceflight, the space station and lunar exploration.
Real Thermal Management’s active cooling system has operated continuously in orbit for more than three years aboard the Yinhe Lingxi-03 satellite.
Its systems were also deployed on the Chenguang-1 and LandSpace Hongqing Honghu-03 satellites in 2026, with five satellites expected to be operating with its active thermal-control systems by year-end.
