- Chinese startups in eVTOLs, AI memory and silicon photonics chips raised fresh funding to fuel their expansion
- New capital will support certification, production and next-generation AI and optical chips
Range Aviation nets over $15 million in third pre-Series A tranche
Hefei-based eVTOL developer Range Aviation (览翌航空) has completed the third tranche of its pre-Series A round, raising more than 100 million yuan ($15 million).
Wuhan Optics Valley Transportation Investment, Optics Valley Industrial Investment and Changjiang Capital jointly participated in the round, which marks the company’s first individual financing exceeding 100 million yuan.
Founded in 2022, Range Aviation is developing the LE200-L, a medium-sized logistics drone, and the LE200, a large passenger-carrying eVTOL.
The LE200 began its type-certification review in 2024, becoming one of the first passenger eVTOL models in China to enter the formal airworthiness certification process. The LE200-L completed its maiden flight in November 2025.
The two aircraft have attracted more than 600 letters of intent combined. According to a third-party estimate, the LE200 could reduce per-seat operating costs by about 65% compared with conventional helicopters in typical intercity commuting scenarios.
Range Aviation has also signed framework agreements covering initial deliveries with several general aviation operators.
The new funding will support LE200 development and airworthiness certification, as well as construction of production capacity in Wuhan’s Donghu District, strengthening the company’s foothold in central China.
AI memory firm MemTensor closes follow-on pre-Series A+ funding
Shanghai-based AI memory startup MemTensor (记忆张量) has completed a pre-Series A+ financing round led by Oriental Fortune Capital, with Shanghai’s state-backed Fortera Capital also increasing its investment. Yaohong Venture Capital and Wuxi Shang Capital participated. The amount was not disclosed.
The round marks MemTensor’s second financing in just two months. In July, the company completed a pre-Series A round worth more than 100 million yuan, backed by Huawei Habo, Honor’s strategic investment arm, SenseTime’s SenseCapital, Shenzhen Capital Group and MSA Capital.
Following the latest round, MemTensor says it has become the highest-valued company among Chinese startups at the Pre-A stage in the AI memory sector.
Founded in 2023, MemTensor introduced its Memory³ hierarchical memory theory and subsequently developed MemOS, which it describes as the first memory operating system for large language models.
The open-source project has surpassed 10,000 GitHub stars and its cloud service now handles more than 50 million calls per month.
The company has established partnerships with several major cloud providers and embodied-AI companies.
The latest funding will be invested in Metis, its memory-native foundation model, as MemTensor seeks to shift AI systems from one-off intelligence toward persistent, long-term intelligence.
China Science Photon Chip secures Series B+ financing round
Silicon photonics company China Science Photon Chip (国科光芯) has completed a Series B+ financing round worth hundreds of millions of yuan.
The round was led by Sichuan Science and Technology Innovation Investment Group, with Hangzhou Kaitai Capital, Shandong Scitech Innovation Group and other investors participating.
Founded in 2019 and based in Jiaxing’s Haining, China Science Photon Chip builds silicon-photonics technologies around silicon nitride, an emerging material platform. Its capabilities span materials and process development, chip design and integrated packaging.
Its product portfolio includes 400G, 800G and 1.6T data-center silicon photonics chips, as well as lidar chips. The company has been recognized as a national-level “Little Giant” enterprise.
Its silicon-nitride photonics platform can reduce optical loss by more than 50% compared with conventional silicon-photonics technology, giving it performance advantages in coherent communications and sensing applications.
The latest funding will support development of next-generation products, including single-wavelength 400Gbps silicon-photonics chips, 1.6T and 3.2T photodetector chips, 3.2T and 6.4T NPO/CPO products, and OIO chiplets.
The company also plans to expand production capacity at its data-communications subsidiary and establish an overseas delivery center.
